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$963.54
Original: $2,752.97
-65%Magico APOD8 Feet—
$2,752.97
$963.54The Story
Utilizing the same design principles as the renowned QPod for front end equipment as well as the SPod and MPod for heavier speaker and amplifier loads, the APod is the ideal coupling mechanism for A-Series speakers as well as the S1 MkII. Based on the scientific design principles of Constrained Layer Damping, unwanted mechanical energy is dissipated away from the enclosure.
Demonstrable results include increased dynamics, enhanced focus, greater resolution, and a closer representation of the original musical performance as it was intended during the recording process. The main structure of the APod is formed from multiple machined aluminum sections which when assembled form a vertical stack. A solid pure copper substrate center round is sandwiched by a top and bottom layer of aluminum that when compressed together facilitates the Constrained Layer Damping (CLD) function.
The main structure of the SPod is formed from multiple machined aluminum sections which when assembled form a vertical stack. A solid pure copper substrate center round is sandwiched by a top and bottom layer of aluminum that when compressed together facilitates the Constrained Layer Damping (CLD) function.
Demonstrable results include increased dynamics, enhanced focus, greater resolution, and a closer representation of the original musical performance as it was intended during the recording process. The main structure of the APod is formed from multiple machined aluminum sections which when assembled form a vertical stack. A solid pure copper substrate center round is sandwiched by a top and bottom layer of aluminum that when compressed together facilitates the Constrained Layer Damping (CLD) function.
The main structure of the SPod is formed from multiple machined aluminum sections which when assembled form a vertical stack. A solid pure copper substrate center round is sandwiched by a top and bottom layer of aluminum that when compressed together facilitates the Constrained Layer Damping (CLD) function.
Details & Craftsmanship
Every detail has been carefully considered to bring you the perfect product.
Details & Craftsmanship
Every detail has been carefully considered to bring you the perfect product.
Description
Utilizing the same design principles as the renowned QPod for front end equipment as well as the SPod and MPod for heavier speaker and amplifier loads, the APod is the ideal coupling mechanism for A-Series speakers as well as the S1 MkII. Based on the scientific design principles of Constrained Layer Damping, unwanted mechanical energy is dissipated away from the enclosure.
Demonstrable results include increased dynamics, enhanced focus, greater resolution, and a closer representation of the original musical performance as it was intended during the recording process. The main structure of the APod is formed from multiple machined aluminum sections which when assembled form a vertical stack. A solid pure copper substrate center round is sandwiched by a top and bottom layer of aluminum that when compressed together facilitates the Constrained Layer Damping (CLD) function.
The main structure of the SPod is formed from multiple machined aluminum sections which when assembled form a vertical stack. A solid pure copper substrate center round is sandwiched by a top and bottom layer of aluminum that when compressed together facilitates the Constrained Layer Damping (CLD) function.
Demonstrable results include increased dynamics, enhanced focus, greater resolution, and a closer representation of the original musical performance as it was intended during the recording process. The main structure of the APod is formed from multiple machined aluminum sections which when assembled form a vertical stack. A solid pure copper substrate center round is sandwiched by a top and bottom layer of aluminum that when compressed together facilitates the Constrained Layer Damping (CLD) function.
The main structure of the SPod is formed from multiple machined aluminum sections which when assembled form a vertical stack. A solid pure copper substrate center round is sandwiched by a top and bottom layer of aluminum that when compressed together facilitates the Constrained Layer Damping (CLD) function.
